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디자인과 기술 혁신을 이끄는 PANTECH

PM-L300

Embedded module
이전
PRODUCT INFOMATION
특징 Features
스펙 Specifications
Type
  • Embedded Module
  • BtoB connector
Main Chipset
  • MDM9215
Size (mm)
  • 41.85 x 30 × 5
Bands
  • WCDMA B1, LTE B3/B5 (KOR/SKT)
  • WCDMA B1, LTE B3/B8 (KOR/KT)
  • WCDMA B1/B6/B8/B19, LTE B1/B3/B8/B19/B21/B41 (JPN)
Data Speed
  • LTE FDD Cat 3 (DL 100 / UL 50Mbps)
  • HSPA+ (DL 42 / UL 5.76Mbps)
Memory
  • 2Gb NAND / 1Gb LPDDR
other Features
  • Voice
  • GPS/GNSS
Interface
  • Primary and Diversity / GPS antenna connector
  • 80pin connector
  • HSIC
  • USB2.0 High Speed
  • UART
  • USIM slot
  • GPIO
  • SPI
Software Features
  • Linux (Kernel 3.x)
  • FOTA
  • SMS
  • USB DM